Requisition ID: R10008845 Category: Engineering Location: Linthicum - MD, United States of America Citizenship Required: United States Citizenship Clearance Type: Secret Telecommute: No- Teleworking not available for this position Shift: 1st Shift (United States of America) Travel Required: Yes, 10% of the Time Positions Available: 1 At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. The Advanced Technologies group of Northrop Grumman Mission Systems is seeking an independent and resourceful Semiconductor Dry Etch Engineer. Individual will be responsible for carrying out development and production support of key initiatives at our Advance Technology Laboratory (ATL).Position is located at ATL - located at Linthicum Heights, just outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading edge technology development in superconducting and compound semiconducting electronics.Our devices enable a number of Northrop Grumman's ground based radars, airborne radars, and space systems. Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, production, ongoing long-term and new programs targeting future military platforms.Roles and Responsibilities: Developing new dry etch processes for new materials Developing new dry processes for emerging technologies in both microelectronic and superconducting electronics Responsible for the procurement and start-up of new dry etch process equipment and processes ##NGATLThis requisition may be filled at a higher grade based on qualifications listed below.Basic Qualifications for Principal Semiconductor Dry Etch Engineer: BS or higher in Materials Science, Physics, Chemistry, Electrical Engineer, Chemical Engineering, or closely related with at least 5 years technical related experience in semiconductor fabrication. (3 years with Masters; 0 years with PhD) At least 5 years of experience in a wafer fab in dry etch process engineering. Able to work independently with hands on experience in operating tools and gathering data. Customer oriented mindset with good understanding of material science and plasma chemistry. Must be able to obtain and maintain a DOD Secret Clearance Working knowledge of Continuous Improvement Methodology, Design of Experiments, and Failure Mode & Effect Analysis (FMEA). Basic Qualifications for Senior Principal Semiconductor Dry Etch Engineer: BS or higher in Materials Science, Physics, Chemistry, Electrical Engineer, Chemical Engineering, or closely related with at least 9 years technical related experience in semiconductor fabrication. (7 years with Masters; 4 years with PhD) At least 5 years of experience in a wafer fab in dry etch process engineering. Able to work independently with hands on experience in operating tools and gathering data. Customer oriented mindset with good understanding of material science and plasma chemistry. Must be able to obtain and maintain a DOD Secret Clearance Working knowledge of Continuous Improvement Methodology, Design of Experiments, and Failure Mode & Effect Analysis (FMEA). Preferred Qualifications: Process Development experience Experience in Compound Semiconductors will be highly desired. Experience in transition Processes to Production Environment. Specific experience using the Applied Materials Centura systems and /or equivalent for etch of dielectric and metal. Experience in dual damascene etch integration and experience etching magnetic films is also desirable. Technical team leadership experience Previous experience in wet processing such as resist strip and post-ash cleaning is desirable. User of various software packages commonly found in Semiconductor Wafer Fabs - EMS Systems (FactoryWorks or alike systems), statistical analysis tools, - JMP, Statistica, etc. Current Secret Clearance Salary Range: 96600 - 145000 Salary Range 2: 119800 - 179600 Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit US Citizenship is required for most positions.