Semiconductor Processing Engineer
ECS is seeking a Semiconductor Processing Engineer to work in our Arlington, VA office. Please Note: This position is contingent upon contract award. Job Description: The successful candidate will provide scientific, engineering, and technical assistance (SETA) support to the Defense Advanced Research Projects Agency (DARPA). Fields of expertise include but are not limited to semiconductor processing and VLSI design. Understanding of research and development of novel semiconductor devices and hands on experience with various silicon processing techniques. The candidate will support a DARPA Program Manager in all technical aspects of program development and execution, including: planning; solicitation preparation; proposal/publication evaluation; independent review, analysis, and summary of relevant research; interaction with individuals from academia, industry and government; preparation and presentation of briefing materials, technical reports, and other program documents as required; and other tasks as needed. The candidate will identify, assess, prioritize, and offer recommendations on proposed and emerging technologies to program manager and performers. This position does not entail direct experimental research. Individuals will be expected to work on a multi-disciplinary team environment and work independently. Individuals must demonstrate exceptional professionalism, organizational skills, and the ability to multi-task effectively. The position requires interaction with government customers at all levels of authority and technical acuity, and therefore the individual must be able to effectively communicate technical information through excellent verbal and written skills. Due to the fast-paced environment, individuals must have a dedicated work ethic, be responsive to challenges that arise on the job, be flexible to schedule changes, show initiative and creativity, and be capable of developing new research concepts. Required Skills: Must have a Secret Clearance Master's degree in electrical Engineering, or related field with experience in design, optimization, fabrication, and/or characterization of VLSI circuits. Thorough knowledge of silicon-based VLSI electrical and computer engineering principles at the chip level; experience with CAE/CAD tools, modern design methodologies, and development of solutions for specific design tasks using VLSI engineering principles. Experience with or strong knowledge of design and circuit simulation tools Knowledge of electrical characterization techniques, integration, and advanced packaging techniques. Experience with novel materials and materials selection for integrated circuits. Working experience with equipment used for metal deposition including Electron Beam Evaporation, Sputtering. Knowledge of dielectric deposition including PECVD, Dry/Wet Oxidation and LPCVD furnaces, processes used for wet etching, RIE/ICP etching, metal lift-off patterning, etc. Back-end processing such as Wafer Dicing, wire bonding, etc. University fabrication experience is acceptable. Desired Skills: A PhD in electrical Engineering, or related field with experience in design, optimization, fabrication, and/or characterization of VLSI circuits. Program management experience. Current secret clearance or higher ECS is an equal opportunity employer and does not discriminate or allow discrimination on the basis of race, color, religion, gender, age, national origin, citizenship, disability, veteran status or any other classification protected by federal, state, or local law. ECS promotes affirmative action for minorities, women, disabled persons, and veterans. ECS is a leading mid-sized provider of technology services to the United States Federal Government. We are focused on people, values and purpose. Every day, our 3000+ employees focus on providing their technical talent to support the Federal Agencies and Departments of the US Government to serve, protect and defend the American People.