Requisition ID: R10050921 Category: Engineering Location: Linthicum, Maryland, United States of America Citizenship Required: United States Citizenship Clearance Type: Secret Telecommute: Yes-May consider hybrid teleworking for this position Shift: 1st Shift (United States of America) Travel Required: Yes, 10% of the Time Positions Available: 2 At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems Sector is searching for Digital Subsystems Engineers that are ready to use their knowledge of advanced digital technologies and engineering experience to help us develop deployable solutions for our customers. This position will be filled at the Staff Engineer level. This person will have a technology leadership position that will span multiple roles: Team Member - Working with interdisciplinary teams to develop digital electronic subsystems and allocating functionality to subsystem components Leader - Providing direction and oversight to internal and external design teams developing subsystem modules and components such as Single Board Computers, SoCs, ASICs, and FPGAs Innovator - Designing and modeling digital signal processing and control algorithms implemented in Embedded Processors, ASIC and FPGA technologies Developer - Developing digital electronic subsystem architectures and designs that are compatible with company and industry standards Responsibilities will include: Working with System, Software, RF, Security, and Platform teams to define product architectures to meet customer requirements Implementing DSP algorithms in Matlab/Python or other higher level languages Creating subsystem requirement specifications and directing design engineers during development process Developing integration and test plans for subsystems Collaborating with design and implementation teams to ensure requirements are met on schedule and within budget Monitor and participate in the development of industry standards Learning, applying and driving improvement of internal engineering processes Supporting managers in business capture activities as needed Basic Qualifications: Bachelor's Degree in Electrical Engineering or related STEM field. 14+ years of professional experience in related industry (12 with MS, 9 with PhD) An additional 5 years of experience can be used in lieu of a Bachelor's degree Experience and strong background in developing digital electronic subsystems Domain knowledge and experience in some of the following or similar areas: Radar, Communications, Digital Signal Processing, Digital Receivers, Direct Digital Waveform Generation, Software Defined Radio, SWAP Constrained Processor, Embedded Networking US Citizenship required, with the ability to obtain and maintain a US Security Clearance Preferred Qualifications: MS Degree with at least 12+ years of professional experience in related industry 5+ years of technical leadership experience ACTIVE US Security Clearance at Secret level or higher Aerospace and Defense Experience developing digital electronic modules, circuit boards, ASICs and/or FPGAs Demonstrated expertise in field (eg journal published, patents) DoD Open Architecture and Industry Standards knowledge and experience (eg SOSA, VITA, IEEE) Additional Domain knowledge and experience in some of the following or similar areas: EO/IR Sensors, Sonar and Acoustic Sensors, SWAP Constrained Processing, AI & ML, Multi-chip Modules, System in a Package, Hardware Emulation, Digital Twins, High Speed Interfaces or Embedded Networking Salary Range: $163,800 USD - $245,800 USD Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. The health and safety of our employees and their families is a top priority. The company encourages employees to remain up-to-date on their COVID-19 vaccinations. US Northrop Grumman employees may be required, in the future, to be vaccinated or have an approved disability/medical or religious accommodation, pursuant to future court decisions and/or government action on the currently stayed federal contractor vaccine mandate under Executive Order 14042 https://www.saferfederalworkforce.gov/contractors/. Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit US Citizenship is required for most positions.